Ultra-thin, high quality strained silicon-on-insulator formed by elastic strain transfer

ABSTRACT

A method of forming a semiconductor structure comprising a first strained semiconductor layer over an insulating layer is provided in which the first strained semiconductor layer is relatively thin (less than about 500 Å) and has a low defect density (stacking faults and threading defects). The method of the present invention begins with forming a stress-providing layer, such a SiGe alloy layer over a structure comprising a first semiconductor layer that is located atop an insulating layer. The stress-providing layer and the first semiconductor layer are then patterned into at least one island and thereafter the structure containing the at least one island is heated to a temperature that causes strain transfer from the stress-providing layer to the first semiconductor layer. After strain transfer, the stress-providing layer is removed from the structure to form a first strained semiconductor island layer directly atop said insulating layer.

RELATED APPLICATIONS

This application is related to co-pending and co-assigned U.S. patentapplication Ser. No. 10/300,189, filed Nov. 20, 2002, entitled “RelaxedLow-Defect SGOI For Strained Si CMOS Applications”. The entire contentof the aforementioned U.S. Patent Application is incorporated herein byreference.

FIELD OF THE INVENTION

The present invention relates to a method of fabricating a semiconductorstructure that can be used as a substrate for high performancecomplementary metal oxide semiconductor (CMOS) devices, and moreparticularly to a method of creating a first strained semiconductorlayer over an insulating layer. Even more particularly, the presentinvention provides a method of forming a strainedsemiconductor-on-insulator (SSOI) substrate material.

BACKGROUND OF THE INVENTION

In the semiconductor industry, there has recently been a high-level ofactivity using strained Si-based heterostructures to achieve highcarrier mobility structures for complementary metal oxide semiconductor(CMOS) applications. Traditionally, to boost performance of NFET andPFET devices, the prior art to implement this has been to grow strain Silayers on a thick (on the order of about 1 to about 5 micrometers)relaxed SiGe buffer layers.

Despite the high channel electron mobilites reported for prior artheterostructures, the use of thick SiGe buffer layers has severalnoticeable disadvantages. First, thick SiGe buffer layers are nottypically easy to integrate with existing Si-based CMOS technology.Second, the defect densities, including threading dislocations (TDs) andmisfit dislocations (MDs) are from about 10⁶ to about 10⁸ defects/cm²which are still too high for realistic VLSI (very large scaleintegration) applications. Thirdly, the nature of the prior artstructures precludes selective growth of the SiGe buffer layer so thatcircuits employing devices with strained Si, unstrained Si and SiGematerials are difficult, and in some instances, nearly impossible tointegrate.

In view of the drawbacks mentioned above with prior art methods ofmanufacturing strained-Si based heterostructures in which a relaxed SiGealloy layer remains in the structure, there is a need for developing anew and improved method that allows one to fabricate a strained Si-basedheterostructure, while maintaining the standard CMOS processingprocedures for standard (i.e., unstrained) Si technologies.Specifically, a new method is needed that allows for the fabrication ofa strained semiconductor-on insulator-substrate (SSOI) in which thestrained semiconductor layer is located directly atop an insulatinglayer.

SUMMARY OF THE INVENTION

The present invention provides a method for fabricating a thin (lessthan 500 Å) first semiconductor layer that is mechanically strained in atensile or compressive manner over an insulating layer, which, in turn,exists on a semiconductor substrate. Specifically, the method of thepresent invention allows for the formation of a strainedsemiconductor-on-insulator (SSOI) heterostructure, without the presenceof SiGe in the final structure.

The method of the present invention takes advantage of the visco-elasticproperties of a buried insulating layer of a semiconductor substrate,which includes at least a first semiconductor layer located atop theburied insulating layer, when it is heated to high temperatures.Initially, a stress-providing layer, such as a strained SiGe alloylayer, a strained SiN layer, a strained SiC layer or any other layerthat can be formed under either compressive or tensile strain, is formedon a surface of the first semiconductor layer of the substrate. Thestress-providing layer can be under tensile or compressive stress atthis point of the inventive process. The stress-providing layer and thefirst semiconductor layer are then patterned into islands using standardlithographic and etching techniques. A high-temperature annealing stepis then performed to allow elastic relaxation of the stress-providinglayer by expansion of the underlying first semiconductor layer on thenow viscous buried insulating layer. At, or about, equilibrium, thein-plane forces arising from the stress (compressive or tensile) in thestress-providing layer are balanced by the stress (compressive ortensile), which has been transferred to the underlying firstsemiconductor layer as it expands on the buried insulating layer.

The annealing step of the present invention is performed in such a wayas to minimize the amount of Ge diffusion into the first semiconductorlayer. After the annealing step, the stress-providing layer isselectively removed at a temperature below the reflow temperature of theburied insulating layer. The reflow temperature of the buried insulatinglayer can be controlled in the present invention to some extent bydoping it with different elements. For example, boron can be used as adopant species to reduce the reflow temperature of the buried insulatinglayer. After removing the stress-providing layer, what remains is athin, strained (tensile or compressive) first semiconductor layer (lessthan 500 Å) atop the buried insulating layer of the substrate.

In broad terms, the method of the present invention, which may also bereferred to as Visco-Elastic Strain Transfer (VEST), includes the stepsof:

-   -   forming a stress-providing layer over a structure comprising a        first semiconductor layer, said first semiconductor layer is        located atop an insulating layer;    -   patterning said stress-providing layer and said first        semiconductor layer into at least one island;    -   heating the structure containing said at least one island to a        temperature that causes strain transfer from the        stress-providing layer to the first semiconductor layer; and    -   removing the stress-providing layer to form a first strained        semiconductor island layer directly atop said insulating layer.

In some embodiments of the present invention, the VEST method describedabove can be modified so as to form a strainedsemiconductor-on-insulator (SSOI) that has selective strain values(positive and negative) by providing islands that have differentstress-providing layers, e.g., SiGe/Si or SiN/Si.

In addition to the VEST method described above, the present inventionalso provides a strained semiconductor-on-insulator (SSOI)heterostructure in which at least one thin (less than 500 Å) strainedfirst semiconductor island layer is located atop a buried insulatinglayer, where the strained first semiconductor island layer has a lowstacking fault (SF) defect density (less than about 1000 SF defects/cm²)and a low threading defect density (on the order of less than about 10⁶TDs/cm²).

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A–1D are pictorial representations (through cross sectionalviews) illustrating the basic processing steps that are employed in thepresent invention in fabricating a first strained semiconductor layer ontop of an insulating layer.

FIG. 2 is a pictorial representation (through a cross sectional view)illustrating a strained semiconductor-on-insulator (SSOI) with selectivestrain values (positive or negative) that is formed using an alternativeembodiment of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

The present invention, which provides a method of fabricating a strainedsemiconductor-on-insulator (SSOI) heterostructure as well as alow-defect density (SFs and TDs) SSOI heterostructure produced by theinventive method, will now be described in greater detail by referringto the drawings that accompany the present application. The accompanyingdrawings, which are not drawn to scale, are provided for illustrativepurposes only and like and/or corresponding elements referred to in thedrawings are described with respect to like reference numerals.

The VEST process begins with first providing a layered structure 10 suchas shown in FIG. 1A. Layered structure 10 includes a semiconductorsubstrate 12 having a stress-providing layer 20 located on an uppersurface thereof. The semiconductor substrate 12 includes a bottomsemiconductor layer 14, a buried insulating layer 16 and a topsemiconductor layer 18 (hereinafter referred to as the firstsemiconductor layer).

In the embodiment depicted in FIG. 1A, the buried insulating layer 16 ispresent continuously throughout the entire structure. In anotherembodiment, which is not shown herein, the buried insulating layer 16 ispresent as discrete and isolated regions or islands that are surroundedby semiconductor material, i.e., layers 14 and 18.

The first semiconductor layer 18 comprises any semiconductor materialwhich can have a strain imparted thereon. Examples of such semiconductormaterials for the first semiconductor layer 18 include, but are notlimited to: Si, SiC, SiGe, SiGeC, Ge, GaAs, InAs, InP or other III/V orII/V compound semiconductors. Preferably, the first semiconductor layer18 is a Si-containing semiconductor material such as Si, SiC, SiGe, orSiGeC. Even more preferably, the first semiconductor layer 18 ofsemiconductor substrate 12 is comprised of Si or SiGe. The firstsemiconductor layer 18 is a single crystal material that typically has amisfit and TD density of less than about 1×10⁵ defects/cm².

The buried insulating layer 16 of the layered structure 10 shown in FIG.1A comprises any material that is highly resistant to Ge diffusion.Examples of such insulating and Ge diffusion resistant materialsinclude, but are not limited to: crystalline or non-crystalline oxidesor nitrides. In one preferred embodiment, the buried insulating layer 16is an oxide such as SiO₂.

The bottom semiconductor layer 14 of the substrate 12 includes anysemiconductor material which can be the same or different than thesemiconductor material of the first semiconductor layer 18.

The semiconductor substrate 12 may be a conventionalsilicon-on-insulator (SOI) substrate material wherein region 16 is aburied oxide (BOX) that electrically isolates a first semiconductorlayer 18 from the bottom semiconductor 12. The SOI substrate may beformed utilizing conventional SIMOX (separation by ion implantation ofoxygen) processes well-known to those skilled in the art, as well as thevarious SIMOX processes mentioned in co-assigned U.S. patent applicationSer. No. 09/861,593, filed May 21, 2001; Ser. No. 09/861,594, filed May21, 2001, now U.S. Pat. No. 6,486,037; Ser. No. 09/861,590, filed May21, 2001, now U.S. Pat. No. 6,602,757; Ser. No. 09/861,596, filed May21, 200, now U.S. Pat. Nos. 6,541,356; and Ser. No. 09/884,670, filedJun. 19, 2001 as well as U.S. Pat. No. 5,930,634 to Sadana, et al., theentire contents of each are incorporated herein by reference. Note thatthe process disclosed in the '590 application can be employed herein tofabricate a patterned substrate.

Alternatively, the semiconductor substrate 12 may be made using otherconventional processes including, for example, a layer transfer processin which thermal bonding and cutting are employed. In addition to thesemethods that form SOI substrates, the semiconductor substrate 12 may bea non-SOI substrate, which is made using conventional depositionprocesses as well as lithography and etching (employed when fabricatinga patterned substrate). Specifically, when non-SOI substrates areemployed, the initial structure is formed by depositing an insulatinglayer atop a surface of a semiconductor substrate, via conventionaldeposition or thermal growing processes, optionally patterning theinsulating layer by employing conventional lithography and etching, andthereafter forming a first semiconductor layer atop the insulating layerusing conventional deposition processes including, for example, chemicalvapor deposition (CVD), plasma-assisted CVD, sputtering, evaporation,chemical solution deposition or epitaxial growth.

The thickness of the various layers of the semiconductor substrate 12may vary depending on the process used in making the same. Typically,however, the first semiconductor layer 18 has a thickness that is lessthan about 500 Å, with a thickness from about 50 to about 450 Å beingmore typical. In the case of buried insulating layer 16, that layer mayhave a thickness from about 200 to about 20000 Å, with a thickness fromabout 500 to about 5000 Å being more typical. The thickness of thebottom semiconductor layer 14 is inconsequential to the presentinvention. It is noted that the thicknesses provided above are exemplaryand by no ways limit the scope of the present invention.

A stress-providing layer 20 is then formed atop the upper surface layer,i.e., atop the first semiconductor layer 18, of the semiconductorsubstrate 12. The stress-providing layer 20 includes any material thatis capable of inducing a stress to the underlying first semiconductorlayer 18. The strain may be a compressive stress or a tensile stressdepending on the type of material being deposited as well as the type ofmaterial present in the first semiconductor layer 18. Examples ofstress-providing materials that can be employed as layer 20 include, butare not limited to: Ge-containing materials, such as pure Ge or a SiGealloy layer that contain up to 99.99 atomic percent Ge, SiN, SiC, andsilicate glasses such as boron phosphorous doped silicate (BPSG). Insome preferred embodiments, the stress-providing layer 20 is comprisedof a Ge-containing material, particularly a SiGe alloy, while in othersthe stress-providing layer 20 is comprised of SiN.

The stress-providing layer 20 can be formed by an epitaxial growthprocess including, for example, low-pressure chemical vapor deposition(LPCVD), ultra-high vacuum chemical vapor deposition (UHVCVD),atmospheric pressure chemical vapor deposition (APCVD), molecular beamepitaxy (MBE) and plasma-enhanced chemical vapor deposition (PECVD).

The thickness of the stress-providing layer 20 can vary depending uponthe type of material and method used in forming the same. Typically, thestress-providing layer 20 has a thickness that is greater than theunderlying first semiconductor layer 18. An illustrative thickness rangefor the stress-providing layer 20 is from about 200 to about 20000 Å,with a range from about 300 to about 5000 Å being more typical.

After providing the layered structure 10 shown in FIG. 1A, the structureshown in FIG. 1A may then be subjected to an optional ion implantationstep wherein dopants that are capable of controlling the reflowtemperature of the buried insulating layer 16 are implanted. The implantmay be performed with, or without, the use of an implantation mask.

The types of dopant species that can be implanted at this point of thepresent invention include B, Al, P, Sb, As, Cs, Na, and/or F. The dopantspecies are implanted using conditions such that the peak dopantconcentration is located substantially within the buried insulatinglayer 16.

The implant step of the present invention is conducted at approximatelyroom temperature, i.e., a temperature from about 283 K to about 303 K,using a beam current density from about 0.01 to about 1 microamps/Cm².The concentration of the dopant species may vary depending upon the typeof species employed. Typically, however, the concentration of dopantspecies being implanted at this point of the present invention is below10¹⁷ cm⁻², with an ion concentration from about 10¹⁴ to about 10¹⁶ cm⁻²being more highly preferred. The energy of this implant may also varydepending upon the type of dopant species that is being implanted, withthe proviso that the implant energy must be capable of positioning ionssubstantially within the buried insulating layer 16. For example, whenboron is employed as the implant species, the energy used to ensure thatthe boron is substantially implanted into the buried insulating layer 16is from about 10 to about 200 keV, with an energy from about 20 to about150 keV being more highly preferred.

In another embodiment, energetic ions are optionally implanted into thelayered structure 10 shown in FIG. 1A so that the energetic ions areimplanted into, or near, the interface formed between the firstsemiconductor layer 18 and the buried insulating layer 16. The implantof energetic ions may be performed alone or in conjunction with thedopant species implant. It may occur before or after the implant of thedopant species. This implant of energetic ions serves to minimizediffusion of Ge from the stress-providing layer 20 when the same iscomprised of a Ge-containing layer by lowering the thermal budgetnecessary to transfer strain from layer 20 to layer 18. Hydrogen,deuterium, helium, oxygen, neon, and mixtures thereof can be used tolower the thermal budget necessary to transfer strain from layer 20 tolayer 18. It is believed that damage at the buried insulating layer16/first semiconductor layer 18 interface facilitates lateral expansionof the island thereby lowering the temperature and/or time required forstrain transfer. Isotopes of the aforementioned energetic ions are alsocontemplated herein. Preferred ions used in the present invention forthis implant are hydrogen ions (H⁺). It is noted that other species ofhydrogen such as H₂ ⁺ can also contemplated herein.

This optional implant step of the present invention at, or near theinterface formed between the first semiconductor layer 18 and the buriedinsulating layer 16 is conducted at approximately room temperature,i.e., a temperature from about 283 K to about 303 K, using a beamcurrent density from about 0.01 to about 1 microamp/cm². Theconcentration of the energetic ions being implanted may vary dependingupon the type of implant species employed. Typically, however, theconcentration of the energetic ions used at this point of the presentinvention is below 3E16 cm⁻², with an ion concentration from about 1E16to about 2.99E16 cm⁻² being more highly preferred. The energy of thisimplant may also vary depending upon the type of ion that is beingimplanted, with the proviso that the implant energy must be capable ofpositioning ions at, or near, the first semiconductor/buried insulatinglayer interface. For example, when hydrogen is employed as the implantion, the energy used is from about 1 to about 100 keV, with an energyfrom about 3 to about 20 keV being more highly preferred.

It is noted one of the implant steps mentioned above may be used, bothimplant steps (in any order) may be used or none of the implant stepsmay be used.

Next, the layered structure 10, particularly the stress-providing layer20 and the first semiconductor layer 18, are patterned so as to form atleast one island 22 comprising a stress-providing/first semiconductorbilayer on the surface of the buried insulating layer 16. The resultantstructure including the at least one island 22 is shown, for example, inFIG. 1B.

The patterning is achieved using conventional lithography and etching.The lithography step includes forming a photoresist (not shown) on thesurface of the stress-providing layer 20, subjecting the photoresist toa pattern of radiation and developing the photoresist using aconventional resist developer. The etching step includes anyconventional etching process including, for example, a dry etchingprocess such as reactive-ion etching, ion beam etching, plasma etchingor laser ablation; a wet etch process in which a chemical etchant isemployed; or any combination thereof. A single etch may be used ormultiple etching steps can be used. The patterned resist can be removedprior to pattern transfer into the at least the stress-providing layer20, or the patterned resist is removed after etching has been completed.Removal of the patterned resist is achieved by a conventional resiststripping process.

It is noted that although the drawings depict the formation of a singleisland structure 22, the present invention also contemplates theformation of a multitude of such island structures 22 on the surface ofburied insulating layer 16. Each island 22 is generally small in size,having a lateral width of about 500 μm or less. More preferably, theisland 22 has a lateral width from about 0.01 to about 100 μm. It shouldbe noted that the width of the island 22 formed by the present inventionmust be sufficient to permit relaxation of the stress-providing film 20by ensuring that the forces of relaxation in the island 22 outweigh theforces that oppose relaxation.

Next, a high temperature annealing process is performed which will allowstrain transfer from the stress-providing layer 20 to the firstsemiconductor layer 18. The resultant structure formed after the hightemperature annealing step has been performed is shown in FIG. 1C. Inthis drawing, reference numeral 24 is used to denote the strained firstsemiconductor layer. Note that some relaxation of the stress-providinglayer 20 may occur during the high temperature annealing step of thepresent invention.

The heating step of the present invention is an annealing step that isperformed at a temperature that causes the first semiconductor layer 18to expand or contract laterally over the buried insulator layer 16. Thatis, the heating step of the present invention is performed to allowelastic relaxation of the strained-providing layer 20 by expansion ofthe underlying first semiconductor layer 18 on the buried insulatinglayer 16, which becomes viscous during this heating step.

The temperature of the heating step of the present invention is chosento be above the reflow temperature of the buried insulating layer 16 atthe first semiconductor/buried insulating layer interface. Specifically,the heating temperature employed in the present invention which achievesthe above features is typically about 900° C. or greater, with atemperature from about 950° to about 1335° C. being more typical. Withinthe above temperature range, an equilibrium exists between the patternedstress-providing layer 20 and the first semiconductor layer 18 whereinthe in-plane forces arising from the stress-providing layer 20 and theunderlying first semiconductor layer 18 are allowed to cancel byexpansion or contraction on the buried insulating layer 16. Moreover,the heating step of the present invention is performed withintemperatures in which the amount of Ge diffusion is minimized in thecase when the stress-providing layer 20 is a Ge-containing layer.

The heating step is typically carried out in an inert ambient such asHe, Ar, N₂, Xe, Kr, Ne or a mixture thereof. The inert gas ambient mayalso be diluted with an oxygen-containing gas.

The heating step may be carried out for a variable period of time thattypically ranges from about 1 sec to about 1800 minutes, with a timeperiod from about 5 sec to about 600 minutes being more highlypreferred. The heating step may be carried out at a single targetedtemperature, or various ramp and soak cycles using various ramp ratesand soak times can be employed.

After performing the heating step that causes strain transfer, thestress-providing layer 20 is then selectively removed so as to exposethe now strained first semiconductor island layer 24. Thestress-providing layer 20 is removed at this point of the presentinvention utilizing a number of etching techniques that are capable ofselectively removing the stress-providing layer 20. For example, a timedetching process or a selective etching process can be used to remove thestress-providing layer 20 from the structure. The resultant structureformed after removal of the stress-providing layer 20 is shown in FIG.1D.

After removing the stress-providing layer 20, an optional thermaltreatment step may be performed to further improve the characteristicsof the material. The thermal treatment may be a furnace step to annealout residual damage caused by the optional implantations steps.Alternatively, a high temperature anneal in a H-containing ambient maybe performed to remove excess boron from the strained firstsemiconductor layer 24.

In accordance with the present invention, the strained firstsemiconductor island layer 24 is located atop the insulating layer 16and it has a thickness that is relatively thin (less than 500 Å). Thestrain may be compressive or tensile depending on the previous type ofstrain in the stress-providing layer 20. The strained firstsemiconductor island layer 24 has a defect density including misfits andTDs, of about 5×10⁶ defects/cm² or less. The stacking fault (SF) densityof the strained first semiconductor island layer 24 is about 1000defects/cm² or less.

The stacking fault density is measured using the etching techniquedescribed in U.S. Ser. No. 10/654,231, filed Sep. 3, 2003, the entirecontent of which is incorporated herein by reference.

The embodiment depicted in FIGS. 1A–1D describes the case wherein thestrained first semiconductor island layers formed on the surface of theburied insulating layer each have the same type of strain (eitherpositive or negative). In another embodiment of the present invention,as depicted in FIG. 2, a structure containing strained layers ofdifferent strain values (positive and/or negative) are formed atop theburied insulating layer. In particular, FIG. 2 shows a strainedsemiconductor structure that includes first strained semiconductor layer24 of a first stain value on a surface of a buried insulating layer 16,and a second strained semiconductor layer 50 of a second strain value,that differs from the first, located atop the same buried insulatinglayer 16. The second strained semiconductor layer 50 is comprised of oneof the semiconductor materials illustrated above for the firstsemiconductor layer 18.

In the embodiment shown in FIG. 2, two different stress-providing layersand lithography are used in forming the structure. Specifically, a firstblock mask (not shown) is formed over a predetermined portion of thesemiconductor substrate 12 by lithography. With the first block mask inplace, a first stress-providing layer 20 is formed atop the exposedportion of the first semiconductor layer 18. After forming the firststress-providing layer, the first block mask is removed and a secondblock mask is formed atop the portion of the layered structure includingthe first stress-providing layer 20. After second block mask formationwhich is performed via lithography, a second stress-providing layer thathas a different stress value is formed atop the exposed portions of thefirst semiconductor layer 18 and the second block mask is removed. Aconventional resist stripping process can be used in removing each ofthe block masks from the structure. The process flow is then the same asdescribed above in FIGS. 1B–1D.

Alternatively, the structure shown in FIG. 2 can be formed by firstperforming the process steps depicted in FIGS. 1A–1D, then forming ablock mask over the thus formed strained first semiconductor islandlayer 24. A semiconductor material including materials described abovefor the first semiconductor layer 18 can then be deposited atop exposedportions of the buried insulating layer 16. After deposition of thesemiconductor material (which can be the same or different from layer18), a second stress-providing layer having a different strain valuethan the first stress-providing layer is formed atop the semiconductormaterial and the processing steps described in FIGS. 1B–1D are thenperformed.

As an example, a 600 Å thick, 17 atomic percent SiGe layer was depositedon a 350 A thick SOI layer. Implantation of H was performed at 6.7 keVto a dose of 2.5×10¹⁶H/cm² placing the ion peak near the buriedoxide/SOI layer. The SiGe/SOI layers were then patterned into roughly10×10 μm islands and subjected to a 1100° C. rapid thermal anneal (fewseconds). The SiGe was measured to be 40% relaxed thereby transferring0.24% tensile strain into the underlying thin SOI layer. The extent ofGe diffusion into the SOI layer is below 15 Å for this thermal budget.

While the present invention has been particularly shown and describedwith respect to preferred embodiments thereof, it will be understood bythose skilled in the art that the foregoing and other changes in formsand details may be made without departing from the spirit and scope ofthe present invention. It is therefore intended that the presentinvention not be limited to the exact forms and details described andillustrated, but fall within the scope of the appended claims.

1. A method of forming a first strained semiconductor layer over aninsulating layer comprising the steps of: forming a stress-providinglayer over a structure comprising a first semiconductor layer, saidfirst semiconductor layer is located atop an insulating layer;patterning said stress-providing layer and said first semiconductorlayer into at least one island; heating the structure containing said atleast one island to a temperature that causes strain transfer from thestress-providing layer to the first semiconductor layer; and removingthe stress-providing layer to form a first strained semiconductor islandlayer directly atop said insulating layer.
 2. The method of claim 1wherein said first semiconductor layer and said insulating layer arecomponents of a preformed silicon-on-insulator substrate.
 3. The methodof claim 2 wherein said preformed silicon-on-insulator substrate isfabricated by separation by ion implantation of oxygen or a layertransfer process.
 4. The method of claim 1 wherein at least oneimplantation step is performed between said forming and patterning step.5. The method of claim 4 wherein said at least one implantation stepcomprises implanting a dopant species into at least said insulatinglayer.
 6. The method of claim 5 wherein said dopant species is boron. 7.The method of claim 4 wherein said at least one implantation stepcomprises implanting an energetic ion at, or near, an interface formedbetween the first semiconductor layer and the insulating layer.
 8. Themethod of claim 7 wherein said energetic ion comprises hydrogen,deuterium, helium, oxygen, neon or mixtures and isotopes thereof.
 9. Themethod of claim 7 wherein said energetic ion is a hydrogen ion.
 10. Themethod of claim 1 wherein said patterning comprises lithography andetching.
 11. The method of claim 1 wherein said first semiconductorlayer comprises Si, SiC, SiGe, SiGeC, Ge, GaAs, InAs or InP.
 12. Themethod of claim 1 wherein said stress-providing layer comprises aGe-containing layer, a silicon nitride layer, a silicon carbide layer, asilicate glass or mixtures thereof.
 13. The method of claim 1 whereinsaid heating step is performed at a temperature that causes theinsulating layer to have a visco-elastic property.
 14. The method ofclaim 13 wherein said heating is performed at a temperature that isabout 900° C. or greater.
 15. The method of claim 1 wherein said firststrained semiconductor layer has a tensile strain.
 16. The method ofclaim 1 wherein said first strained semiconductor layer has acompressive strain.
 17. The method of claim 1 further comprising forminga second island having a second stress-providing layer that has adifferent stress then the stress in said stress-providing layer.
 18. Themethod of claim 1 wherein said first semiconductor layer comprises III/Vor II/VI compound semiconductor, where II, III, V and VI representsgroups from the Periodic Table of Elements.